Aluminum Heatsink Cooling Fin for Thermal Management - Heat Sink for Power IC and LED Light Devices - Light Weight Aluminum Dissipation Plate - 100 mm x 100 mm x 18 mm - 1 Piece

Description

• Aluminum Construction: This component is manufactured from aluminum to provide thermal conductivity for heat dissipation in electronic assemblies.
• Surface Area Optimization: The cooling fin design is configured to increase the total surface area in contact with ambient air to facilitate efficient thermal transfer.
• Precise Dimensions: The unit measures 100 mm in length, 100 mm in width, and 18 mm in height for integration into standard electronic enclosures and cooling systems.
• Light Weight Design: The aluminum material provides a low mass solution suitable for applications where total assembly weight is a critical factor in system design.
• Versatile Application: This cooling component is suitable for use with computer processors, power IC units, power electric devices, and LED light systems to manage operating temperatures.

Description:
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices, where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

Features: Made of high quantity aluminum, good thermal conductivity.
Reduce the risk of hardware failure due to overheating.
Designed to maximize its surface area in contact with the cooling air.
Light weight and used in applications where weight is a big concern.
Widely use for computer, power IC, power electric device, LED light devices, etc.

Specifications:
Material: Aluminum
Fins: 16
Size: 100*100*18mm / 3.93 x 3.93 x 0.7"
Quantity: 1
Weight: 123g(approx.)

Package Includes:
1 x Heat Sink

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